Power module package for direct cooling multiple power modules

ABSTRACT

According to an aspect, a power module package includes a plurality of power modules including a first power module and a second power module, a plurality of heat sinks including a first heat sink coupled to the first power module and a second heat sink coupled to the second power module, and a module carrier coupled to the plurality of power modules, where the module carrier includes a first region defining a first heat-sink slot and a second region defining a second heat-sink slot. The first heat sink extends at least partially through the first heat-sink slot and the second heat sink extends at least partially through the second heat-sink slot. The power module package includes a housing coupled to the module carrier and a ring member located between the module carrier and the housing.

TECHNICAL FIELD

This description relates to a power module package for direct coolingmultiple power modules.

BACKGROUND

A power module package may contain multiple power modules. However, someconventional power module packages may be relatively large to meetcooling performance requirements.

SUMMARY

According to an aspect, a power module package for direct coolingmultiple power modules includes a plurality of power modules including afirst power module and a second power module, a plurality of heat sinksincluding a first heat sink coupled to the first power module and asecond heat sink coupled to the second power module, and a modulecarrier coupled to the plurality of power modules, where the modulecarrier includes a first region defining a first heat-sink slot and asecond region defining a second heat-sink slot. The first heat sinkextends at least partially through the first heat-sink slot and thesecond heat sink extends at least partially through the second heat-sinkslot. The power module package includes a housing coupled to the modulecarrier, where the module carrier is disposed between the housing andthe plurality of power modules. The power module package includes a ringmember located between the module carrier and the housing.

According to some aspects, the power module package may include one ormore of the following features (or any combination thereof). The firstheat sink includes metal pin fins. The first region may include at leastone positioning guide configured to align at least one of the firstpower module or the first heat sink. The module carrier includes aplastic material. The plurality of power modules may include a thirdpower module and the plurality of heat sinks may include a third heatsink coupled to the third power module. The module carrier includes athird region defining a third heat-sink slot, and the third heat sinkextends at least partially through the third heat-sink slot. Each of thefirst power module, the second power module, and the third power modulemay correspond to a separate phase of a three phase current of aninverter. The ring member includes an O-ring that extends around thefirst power module, the second power module, and the third power module,collectively. The first power module includes a half-bridge module. Themodule carrier is coupled to the housing via one or more fasteners.

According to an aspect, a power module package for direct coolingmultiple power modules includes a plurality of power modules including afirst power module, a second power module, and a third power module, aplurality of heat sinks including a first heat sink coupled to the firstpower module, a second heat sink coupled to the second power module, anda third heat sink coupled to the third power module, and a modulecarrier coupled to the plurality of power modules, the module carrierincluding a first region defining a first heat-sink slot, a secondregion defining a second heat-sink slot, and a third region defining athird heat-sink slot. The first heat sink extends at least partiallythrough the first heat-sink slot. The second heat sink extends at leastpartially through the second heat-sink slot. The third heat sink extendsat least partially through the third heat-sink slot. The power packagemodule includes a housing coupled to the module carrier, where thehousing is coupled to the module carrier being located between thehousing and the plurality of power modules.

According to some aspects, the power module package may include one ormore of the following features (or any combination thereof). The powermodule package may include a ring member located between the modulecarrier and a surface of the housing. The first region defines one ormore module positioning guides. The first region defines one or moreheat-sink positioning guides. Each of the first power module, the secondpower module, and the third power module corresponds to a separate phaseof a three phase current of an inverter. Each of the first heat sink,the second heat sink, and the third heat sink include metal pin fins.The module carrier includes a metal-based material.

According to an aspect, a method of assembly a power module packageintegrating multiple power modules includes receiving a module carrier,the module carrier including a first region defining a first heat-sinkslot and a second region defining a second heat-sink slot, applying anadhesive material to the first region and the second region, inserting afirst heat sink coupled to a first power module through the firstheat-sink slot until the first power module contacts the adhesivematerial, and inserting a second heat sink coupled to a second powermodule through the second heat-sink slot until the second power modulecontacts the adhesive material. In some examples, each of the firstregion and the second region defines one or more heat-sink positioningguides.

According to an aspect, a method of assembly a power module packageintegrating multiple power modules includes receiving a module carrier,the module carrier including a first region defining a first heat-sinkslot and a second region defining a second heat-sink slot, inserting afirst heat sink into the first heat-sink slot, inserting a second heatsink into the second heat-sink slot, applying an adhesive to the firstregion, the second region, the first heat sink, and the second heatsink, contacting a first power module to the adhesive on the firstregion and the first heat sink, and contacting a second power module tothe adhesive on the second region and the second heat sink. Each of thefirst region and the second region defines one or more modulepositioning guides and one or more heat-sink positioning guides.

The details of one or more implementations are set forth in theaccompanying drawings and the description below. Other features will beapparent from the description and drawings, and from the claims.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1A illustrates a cross sectional view of a power module packageaccording to an aspect.

FIG. 1B illustrates a module carrier of the power module packageaccording to an aspect.

FIG. 1C illustrates a top view perspective of the power module packageaccording to an aspect.

FIGS. 2A through 2F illustrate a power module package according to anaspect.

FIGS. 3 and 4 illustrate examples of a heat sink according to severalaspects.

FIG. 5A through 5F illustrate a power module package that is assembledaccording to an aspect.

FIG. 6 illustrates a flowchart depicting example operations forassembling a power module package according to an aspect.

FIGS. 7A through 7D illustrate a power module package that is assembledaccording to another aspect.

FIG. 8 illustrates a flowchart depicting example operations forassembling a power module package according to an aspect.

DETAILED DESCRIPTION

The present disclosure relates to a power module package for directcooling multiple power modules. The power module packages discussedherein may be compact, robust, and/or relatively easy to assemble whileproviding an efficient structure to permit direct cooling. The powermodule package includes a plurality of power modules, a plurality ofheat sinks coupled to the power modules, a module carrier coupled to thepower modules, a housing coupled to the module carrier, and a ringmember located (e.g., disposed) between the module carrier and thehousing.

In some examples, the power modules include two power modules. In someexamples, the power modules include three power modules. In someexamples, the power modules include half-bridge power modules. The powermodule package may include a first power module, a second power module,and a third power module, where each module corresponds to a separatephase of a three-phase current (UVM) of an inverter. In some examples,the power modules include more than three power modules.

The power modules are integrated into the module carrier, and the modulecarrier is coupled to the housing such that the module carrier isdisposed between the power modules and the module carrier. In someexamples, the housing is a housing for an inverter. The ring member maybe disposed within a groove on the housing, and may extend around thepower modules, collectively. In some examples, the power module packageincludes a single ring member. The module carrier may define a number ofregions, where each region defines a heat-sink slot. For example, themodule carrier may include a first region defining a first heat-sinkslot and a second region defining a second heat-sink slot. In someexamples, each of the first region and the second region includes one ormore positioning guides that properly align a power module and/or a heatsink on a respective region.

The power package module may be assembled according to a first assemblyprocess. According to the first assembly process, in a pre-processingstep, the heat sinks are coupled to the power modules. For example, thefirst power module is coupled to a first heat sink, and the second powermodule is coupled to a second heat sink. In some examples, the heatsinks include pin fin heat sinks, where a pin fin heat sink includes abase plate with a plurality of pin fins that extend from the base plate.The base plate is coupled to a surface of a power module. According tothe first assembly process, an adhesive material is dispensed on eachregion such as the first region and the second region. The first heatsink is inserted into the first heat-sink slot until the first powermodule contacts the adhesive material on the first region (where thepositioning guide(s) are used to properly align the first power moduleon the first region), and the second heat sink is inserted into thesecond heat-sink slot until the second power module contacts theadhesive material on the second region (where the positioning guide(s)are used to properly align the second power module on the secondregion). Then, the module carrier with the power modules are cured(e.g., oven cured by heat).

The power package module may be assembled according to a second assemblyprocess. According to the second assembly process, the heat sinks areinitially not coupled to the power modules, but rather the individualheat sinks are inserted into the heat-sink slots, and the power modulesare then coupled to the module carrier and the heat sinks. For example,The first heat sink is inserted into the first heat-sink slot (where thepositioning guide(s) are used to properly align the first heat sink onthe first region), and the second heat sink is inserted into the secondheat-sink slot (where the positioning guide(s) are used to properlyalign the second heat sink on the second region. Then, an adhesivematerial is dispensed on the first region, the second region, the firstheat sink, and the second heat sink. The first power module ispositioned on the adhesive material on the first region and the firstheat sink, and the second power module is positioned on the adhesivematerial on the second region and the second heat sink. Then, the modulecarrier with the power modules are cured (e.g., oven cured by heat).

FIGS. 1A through 1C illustrate a power module package 100 for directcooling multiple power modules 102. FIG. 1A illustrates a crosssectional view of the power module package 100. The power module package100 includes a plurality of power modules 102, a plurality of heat sinks110 coupled to the power modules 102, a module carrier 104 coupled tothe power modules 102, a housing 106 coupled to the module carrier 104,and a ring member 108 located (e.g., disposed) between the modulecarrier 104 and the housing 106.

FIG. 1B illustrates an enlarged view of the module carrier 104. Themodule carrier 104 is disposed between the power modules 102 and thehousing 106, where the module carrier 104 defines a number of heat-sinkslots (e.g., 120-1, 120-2, 120-3) that receive (and align) a separateheat sink 110. FIG. 1C illustrates a top view perspective of the powermodule package 100 that depicts the ring member 108 extending around thepower modules 102, collectively. In some examples, the power modulepackage 100 includes a single ring member 108. The ring member 108 maybe disposed between the module carrier 104 and the housing 106 and mayassist with sealing a chamber 124 of the housing 106.

The power module package 100 may be a high-voltage power package. Insome examples, the power module package 100 may operate at voltagesgreater than one thousand volts. The amount of heat generated by thepower modules 102 is reduced by injecting a cooling fluid into thechamber 124 of the housing 106. The cooling fluid may include cooled gassuch as air and/or cooled liquid such as a cooling fluid and/or coolingmixture. The power modules 102 are directly cooled by the cooling fluid.Direct cooling involves the application of a cooling fluid directly on aportion of a power module 102 (e.g., a backside of a power module 102such as a heat sink 110 coupled (e.g., directly coupled) to the powermodule 102). For example, since heat sinks 110 are coupled (e.g.,directly coupled) to the power module 102, the application of coolingfluid to the heat sinks 110 within the chamber 124 directly cools thepower modules 102. In contrast, indirect cooling involves theapplication of a cooling fluid to a component that is sealed from one ormore power modules. The power module package 100 may be relativelycompact, robust, and relatively simple to assemble. In some examples,instead of individually sealing each power module for direct cooling,the power module package 100 uses a module carrier 104 that can seal,collectively, multiple power modules 102 in a compact fashion.

A power module 102 includes one or more silicon powered dies solderedonto one or more substrates, which can be direct bonded copper (DBC)metalized ceramics soldered onto a base plate (e.g., a copper plate). Insome examples, a power module 102 includes one or more silicon-basedpower chips (e.g., insulated-gate bipolar transistor(s) (IGBTs), metaloxide silicon field effect transistor(s) (MOSFETs), diodes, etc.) thatare soldered onto a ceramic-based substrate, which is then soldered to abase plate. In some examples, the power modules 102 include half-bridgemodules (e.g., an inverter leg with two switches and their correspondingantiparallel diodes). However, the power modules 102 may include othertypes of module topologies such as switch, bridge rectifier, H-bridge,etc.

In some examples, the power module package 100 includes half bridgedirect cooling modules that are integrated on an inverter. In someexamples, the power module package 100 includes a three-phase invertercircuit (e.g., a 6-pack module or IGBT 6-pack module). In some examples,the power module package 100 is configured to be used within anautomotive inverter for an electric vehicle or a hybrid vehicle. Forexample, an automotive inverter may accelerate or decelerate the vehicleby converting the direct current (DC) power from the batteries toalternating current (AC) at the frequency required for vehicle speed andother system controls to control the electric motor speed, drive,torque, and/or power. In some examples, the housing 106 is the housingof the automotive inverter.

The power modules 102 include a first power module 102-1 and a secondpower module 102-2. In some examples, the first power module 102-1 is ahalf-bridge power module. In some examples, the second power module102-2 is a half-bridge power module. In some examples, the power modules102 include a third power module 102-3. In some examples, the thirdpower module 102-3 is a half-bridge power module. In some examples, thepower module package 100 includes two power modules 102. In someexamples, the power module package 100 includes three power modules 102.In some examples, the power module package 100 includes more than threepower modules 102. In some examples, each of the first power module102-1, the second power module 102-2, and the third power module 102-3correspond to a separate phase of a three-phase current (UVM) of aninverter. In some examples, the first power module 102-1, the secondpower module 102-2, and the third power module 102-3, collectively,operate as a 6-pack full bridge module.

Each of the power modules 102 include a first surface 111 and a secondsurface 113. The distance between the first surface 111 and the secondsurface 113 may define a thickness of a respective power module 102 in adirection A1. Each power module 102 is connected to a separate heat sink110. In some examples, each power module 102 is connected to a separateheat sink 110 using an adhesive material (e.g., a polymer-basedmaterial, solder material, glue material, etc.). The first power module102-1 is coupled to a first heat sink 110-1, the second power module102-2 is coupled to a second heat sink 110-2, and the third power module102-3 is coupled to a third heat sink 110-3. In further detail, thefirst heat sink 110-1 is coupled to the second surface 113 of the firstpower module 102-1, the second heat sink 110-2 is coupled to the secondsurface 113 of the second power module 102-2, and the third heat sink110-3 is coupled to the second surface 113 of the third power module102-3.

The first heat sink 110-1 extends from the second surface 113 of thefirst power module 102-1 in the direction A1. The second heat sink 110-2extends from the second surface 113 of the second power module 102-2 inthe direction A1. The third heat sink 110-3 extends from the secondsurface 113 of the third power module 102-3 in the direction A1. In someexamples, the first heat sink 110-1 includes a pin fin heat sink. Insome examples, the second heat sink 110-2 includes a pin fin heat sink.In some examples, the third heat sink 110-3 includes a pin fin heatsink. In some examples, a pin fin heat sink includes a base plate thatis coupled to the second surface 113 of a respective power module 102,and a plurality of pin fins that extend in the direction A1.

Each power module 102 is coupled to the module carrier 104 via anadhesive material 112. In some examples, the adhesive material 112includes a polymer-based material. In some examples, the adhesivematerial 112 includes a solder material. In some examples, the adhesivematerial 112 includes a glue material. In some examples, the adhesivematerial 112 includes a transient liquid phase sintering (TLPS)material. The module carrier 104 includes a first surface 115 and asecond surface 117. In some examples, the second surface 117 is parallelwith the first surface 115. The distance between the first surface 115and the second surface 117 may define the thickness of the modulecarrier 104 in the direction A1. The first surface 115 of the modulecarrier 104 is coupled to the second surface 113 of each of the firstpower module 102-1, the second power module 102-2, and the third powermodule 102-3. The first surface 115 is disposed in a plane A4. Thedirection A1 is aligned perpendicular to the plane A4, and a directionA2 is perpendicular to the direction A1. A direction A3 is orthogonal todirections A1 and A2. As shown in FIG. 1A, the direction A3 is depictedinto the page (shown as a dot). However, since FIG. 1B is a top of themodule carrier 104, the direction A1 on FIG. 1B is depicted into thepage (as shown as a dot).

The chamber 124 may be sealed from the power modules 102 via the modulecarrier 104. In other words, the sealing may not be directly on the DBCmaterial of the power modules 102, but rather the sealing is createdusing the module carrier 104. The module carrier 104 is a single(integral) body defining a number of heat-sink slots, where the numberof heat-sink slots corresponds to the number of power modules 102. Themodule carrier 104 is disposed between the power modules 102 and thehousing 106. In some examples, the module carrier 104 may enablerelatively easy integration with the housing 106. In some examples, themodule carrier 104 is a middle plate. In some examples, the modulecarrier 104 includes a plastic material. In some examples, the modulecarrier 104 includes a metal-based material. In some examples, themodule carrier 104 includes an aluminum material. In some examples, themodule carrier 104 includes a copper material. The module carrier 104has a length that extends in the direction A2, a width that extends inthe direction A3, and a thickness that extends in the direction A1. Insome examples, the module carrier 104 has a rectangle shape. However,the module carrier 104 may include other types of shapes including curveand/or rounded portions.

As shown in FIG. 1B, the module carrier 104 includes a first region114-1, a second region 114-2, and a third region 114-3. The first region114-1 is the portion of the module carrier 104 in which the first powermodule 102-1 is mounted. The second region 114-2 is the portion of themodule carrier 104 in which the second power module 102-2 is mounted.The third region 114-3 is the portion of the module carrier 104 in whichthe third power module 102-3 is mounted. In some examples, if the modulecarrier 104 integrates three power modules 102, the module carrier 104may have a total of three regions, were each region has the same size.In some examples, one region may be larger than another region if apower module 102 is larger than another power module 102.

The first region 114-1 defines a heat-sink slot 120-1. The size (e.g.,in the directions A2 and A3) of the heat-sink slot 120-1 is smaller thanthe size (e.g., in the directions A2 and A3) of the first region 114-1.The second region 114-2 defines a heat-sink slot 120-2. The size (e.g.,in the directions A2 and A3) of the heat-sink slot 120-2 is smaller thanthe size (e.g., in the directions A2 and A3) of the second region 114-2.The third region 114-3 defines a heat-sink slot 120-3. The size (e.g.,in the directions A2 and A3) of the heat-sink slot 120-3 is smaller thanthe size (e.g., in the directions A2 and A3) of the third region 114-3.

The module carrier 104 includes a portion 126 that separates theheat-sink slot 120-1 from the heat-sink slot 120-2. The module carrier104 includes a portion 128 that separates the heat-sink slot 120-3 fromthe heat-sink slot 120-2. The module carrier includes a perimeter areaportion 118 that extends around the heat-sink slot 120-1, the heat-sinkslot 120-2, and the heat-sink slot 120-3, collectively. In someexamples, the perimeter area portion 118 is coupled to the housing 106.The heat-sink slot 120-1 has a size that is larger (e.g., slightlylarger) than a size of the first heat sink 110-1, and the heat-sink slot120-1 has a size that is smaller than a size of the first power module102-1. The heat-sink slot 120-2 has a size that is larger (e.g.,slightly larger) than a size of the second heat sink 110-2, and theheat-sink slot 120-2 has a size that is smaller than a size of thesecond power module 102-2. The heat-sink slot 120-3 has a size that islarger (e.g., slightly larger) than a size of the third heat sink 110-3,and the heat-sink slot 120-3 has a size that is smaller than a size ofthe third power module 102-3. Each of the heat-sink slots (120-1, 120-2,120-3) extends between (and through) the first surface 115 of the modulecarrier 104 and the second surface 117 of the module carrier 104.

The first region 114-1 is coupled to the first power module 102-1 suchthat the first heat sink 110-1 at least partially extends (or fullyextends) through the heat-sink slot 120-1 and into the chamber 124 ofthe housing 106. The second region 114-2 is coupled to the second powermodule 102-2 such that the second heat sink 110-2 at least partiallyextends (or fully extends) through the heat-sink slot 120-2 and into thechamber 124 of the housing 106. The third region 114-3 is coupled to thepower module 103-3 such that the third heat sink 110-3 at leastpartially extends (or fully extends) through the heat-sink slot 120-4and into the chamber 124 of the housing 106.

As shown in FIG. 1B, the first region 114-1 may define a positioningguide 116-1 that aligns at least one of the first power module 102-1 orthe first heat sink 110-1 during assembly of the power module package100. In some examples, the positioning guide 116-1 is located on (ordefined by) the first region 114-1 at a location proximate to theheat-sink slot 120-1. In some examples, the positioning guide 116-1 is afeature of the heat-sink slot 120-1. In some examples, the positioningguide 116-1 is a surface feature that interacts with a surface featureof the first power module 102-1 to cause the first power module 102-1 tobe aligned with the first region 114-1 of the module carrier 104. Insome examples, the positioning guide 116-1 is a surface feature thatinteracts with a surface feature of the first heat sink 110-1 to causethe first heat sink 110-1 to be properly aligned within the heat-sinkslot 120-1. In some examples, the positioning guide 116-1 includes oneor more protrusions. In some examples, the positioning guide 116-1includes one or more grooves. In some examples, the positioning guide116-1 includes one or more slots.

The second region 114-2 may define a positioning guide 116-2 that alignsat least one of the second power module 102-2 or the second heat sink110-2. In some examples, the positioning guide 116-2 is located on (ordefined by) the second region 114-2 at a location proximate to theheat-sink slot 120-2. In some examples, the positioning guide 116-2 is afeature of the heat-sink slot 120-2. In some examples, the positioningguide 116-2 is a surface feature that interacts with a surface featureof the second power module 102-2 to cause the second power module 102-2to be aligned with the second region 114-2 of the module carrier 104. Insome examples, the positioning guide 116-2 is a surface feature thatinteracts with a surface feature of the second heat sink 110-2 to causethe second heat sink 110-2 to be properly aligned within the heat-sinkslot 120-2. In some examples, the positioning guide 116-2 includes oneor more protrusions. In some examples, the positioning guide 116-2includes one or more grooves. In some examples, the positioning guide116-2 includes one or more slots.

The third region 114-3 may define a positioning guide 116-3 that alignsat least one of the third power module 102-3 or the third heat sink110-3. In some examples, the positioning guide 116-3 is located on (ordefined by) the third region 114-3 at a location proximate to theheat-sink slot 120-3. In some examples, the positioning guide 116-3 is afeature of the heat-sink slot 120-3. In some examples, the positioningguide 116-3 is a surface feature that interacts with a surface featureof the third power module 102-3 to cause the third power module 102-3 tobe aligned with the third region 114-3 of the module carrier 104. Insome examples, the positioning guide 116-3 is a surface feature thatinteracts with a surface feature of the third heat sink 110-3 to causethe third heat sink 110-3 to be properly aligned with the heat-sink slot120-3. In some examples, the positioning guide 116-3 includes one ormore protrusions. In some examples, the positioning guide 116-3 includesone or more grooves. In some examples, the positioning guide 116-3includes one or more slots.

The housing 106 is coupled to the module carrier 104, where the modulecarrier 104 is positioned between the housing 106 and the power modules102. In some examples, the housing 106 is coupled to the module carrier104 via one or more fasteners. In some examples, the housing 106 iscoupled to the module carrier 104 by welding (e.g., laser welding). Insome examples, the housing 106 includes a plastic material. The housing106 defines a chamber 124, where cooling fluid is injected into thechamber 124 via an opening 125 and expelled from the chamber 124 via anopening 125. Each of the first heat sink 110-1, the second heat sink110-2, and the third heat sink 110-3 includes a portion that is disposedwithin the chamber 124. In some examples, the housing 106 is an inverterhousing. In some examples, the housing 106 is an inverter housing for avehicle.

The power module package 100 includes a ring member 108 that is located(e.g., disposed) between the housing 106 and the module carrier 104. Thering member 108 includes a portion that contacts the housing and aportion that contacts the module carrier 104. In some examples, thehousing 106 may define a groove, and the ring member 108 is positionedin the groove between the housing 106 and the module carrier 104. Thering member 108 extends around the first power module 102-1, the secondpower module 102-2, and the third power module 102-3, collectively. Insome examples, the ring member 108 includes an O-ring. In some examples,the power module package 100 includes a single ring member 108.

FIGS. 2A through 2F illustrate a power module package 200 for directcooling multiple power modules 202. The power module package 200 may bean example of the power module package 100 of FIGS. 1A through 1C. Thepower module package 200 includes a plurality of power modules 202, aplurality of heat sinks 210 coupled to the power modules 202, a modulecarrier 204 coupled to the power modules 202, a housing 206 coupled tothe module carrier 204, and a ring member 208 located (e.g., disposed)between the module carrier 204 and the housing 206. FIG. 2A illustratesa perspective of the power module package 200. FIG. 2B illustrates aperspective of the power module package 200 with the power modules 202being transparent. FIG. 2C illustrates a top view perspective of themodule carrier 204. FIG. 2D illustrates a region of the module carrier204. FIG. 2E illustrates a cross sectional view of the power modulepackage 200. FIG. 2F illustrates a side view of a power module 202.

The power modules 202 include a first power module 202-1, a second powermodule 202-2, and a third power module 202-3. In some examples, each ofthe first power module 202-1, the second power module 202-2, and thethird power module 202-3 correspond to a separate phase of a three-phasecurrent (UVM) of an inverter. In some examples, the first power module202-1, the second power module 202-2, and the third power module 202-3,collectively, operate as a 6-pack full bridge module. In some examples,the power modules 202 includes terminals 230 and contacts 232. In someexamples, the terminals 230 extend in the direction A1, and the contacts232 extend in the direction A2.

As shown in FIG. 2F, a power module 202 includes a first surface 211 anda second surface 213. The distance between the first surface 211 and thesecond surface 213 may define a thickness of a respective power module202 in a direction A1. Each power module 202 is connected to a separateheat sink 210. In some examples, each power module 202 is connected to aseparate heat sink 210 using an adhesive material. The first powermodule 202-1 is coupled to a first heat sink 210-1, the second powermodule 202-2 is coupled to a second heat sink 210-2, and the third powermodule 202-3 is coupled to a third heat sink 210-3. In further detail,the first heat sink 210-1 is coupled to the second surface 213 of thefirst power module 202-1, the second heat sink 210-2 is coupled to thesecond surface 213 of the second power module 202-2, and the third heatsink 210-3 is coupled to the second surface 213 of the third powermodule 202-3.

The first heat sink 210-1 extends from the second surface 213 of thefirst power module 202-1 in the direction A1. The second heat sink 210-2extends from the second surface 213 of the second power module 202-2 inthe direction A1. The third heat sink 210-3 extends from the secondsurface 213 of the third power module 202-3 in the direction A1. Each ofthe first heat sink 210-1, the second heat sink 210-2, and the thirdheat sink 210-3 includes a pin fin heat sink.

Each power module 202 is coupled to the module carrier 204 via anadhesive material 212. The module carrier 204 includes a first surface215 and a second surface 217. In some examples, the second surface 217is parallel with the first surface 215. The distance between the firstsurface 215 and the second surface 217 may define the thickness of themodule carrier 204 in the direction A1. The first surface 215 of themodule carrier 204 is coupled to the second surface 213 of each of thefirst power module 202-1, the second power module 202-2, and the thirdpower module 202-3. The first surface 215 is disposed in a plane A4.

The chamber 224 may be sealed from the power modules 202 via the modulecarrier 204. In other words, the sealing may not be directly on the DBCmaterial of the power modules 102. The module carrier 204 is a single(integral) body defining a number of heat-sink slots, where the numberof heat-sink slots corresponds to the number of power modules 202. Themodule carrier 204 is disposed between the power modules 202 and thehousing 206. In some examples, the module carrier 204 is a middle plate.In some examples, the module carrier 204 includes a plastic material. Insome examples, the module carrier 204 includes a metal-based material.In some examples, the module carrier 204 includes an aluminum material.In some examples, the module carrier 204 includes a copper material. Themodule carrier 204 has a length that extends in the direction A2, awidth that extends in the direction A3, and a thickness that extends inthe direction A1. In some examples, the module carrier 204 has arectangle shape. However, the module carrier 204 may include other typesof shapes includes curved or rounded portions.

As shown in FIG. 2C, the module carrier 104 includes a first region214-1, a second region 214-2, and a third region 214-3. The first region214-1 defines a heat-sink slot 220-1. The second region 214-2 defines aheat-sink slot 220-2. The third region 214-3 defines a heat-sink slot220-3. The module carrier 204 includes a portion 226 that separates theheat-sink slot 220-1 from the heat-sink slot 220-2. The module carrier204 includes a portion 228 that separates the heat-sink slot 220-3 fromthe heat-sink slot 220-2. The module carrier 204 includes a perimeterarea portion 218 that extends around the heat-sink slot 220-1, theheat-sink slot 220-2, and the heat-sink slot 220-3, collectively. Insome examples, the module carrier 204 defines openings 236 that are usedto fasten the module carrier 204 to the housing 206. In some examples,the openings 236 are defined on the perimeter area portion 218 at thecorner portions of the module carrier 204. As shown in FIG. 2E,fasteners 205 may extend through the openings 236 and into the housing206. In some examples, fasteners 205 are not used, but rather the modulecarrier 204 is coupled to the housing 206 via other coupling mechanismssuch as welding (e.g., laser welding.

The heat-sink slot 220-1 has a size that is larger than a size of thefirst heat sink 210-1, and the heat-sink slot 220-1 has a size that issmaller than a size of the first power module 202-1. The heat-sink slot220-2 has a size that is larger than a size of the second heat sink210-2, and the heat-sink slot 220-2 has a size that is smaller than asize of the second power module 202-2. The heat-sink slot 220-3 has asize that is larger than a size of the third heat sink 210-3, and theheat-sink slot 220-3 has a size that is smaller than a size of the thirdpower module 202-3. Each of the heat-sink slots (220-1, 220-2, 220-3)extends between (and through) the first surface 215 of the modulecarrier 204 and the second surface 217 of the module carrier 204.

The first region 214-1 is coupled to the first power module 202-1 suchthat the first heat sink 210-1 extends through the heat-sink slot 220-1and into the chamber 224 of the housing 206. The second region 214-2 iscoupled to the second power module 202-2 such that the second heat sink210-2 extends through the heat-sink slot 220-2 and into the chamber 224of the housing 206. The third region 214-3 is coupled to the powermodule 203-3 such that the third heat sink 210-3 extends through theheat-sink slot 220-4 and into the chamber 224 of the housing 206.

As shown in FIG. 2D, in some examples, the first region 214-1 may definemodule positioning guides 240. The module positioning guides 240 may bean example of the positioning guide 116-1 of FIG. 1B. The modulepositioning guides 240 are surface features configured to interact withsurface features on the first power module 202-1 to properly align thefirst power module 202-1 with the first region 214-1. Although fourmodule positioning guides 240 are depicted in FIG. 2D, the first region214-1 may define any number of module positioning guides 240. In someexamples, the module positioning guides 240 include protrusions thatextend from the second surface 217 of the module carrier 204, where theprotrusions interact with slots defined by the first power module 202-1.In some examples, the module positioning guides 240 include slots thatextend into the second surface 217 of the module carrier 204, where theslots interact with protrusions defined by the first power module 202-1.

In some examples, the first region 214-1 may include heat-sinkpositioning guides 242. The heat-sink positioning guides 242 may be anexample of the positioning guide 116-1 of FIG. 1B. In some examples, thefirst region 214-1 includes the module positioning guides 240 but notthe heat-sink positioning guides 242. In some examples, the first region214-1 includes the heat-sink positioning guides 242 but not the modulepositioning guides 242. In some examples, the first region 214-1includes the module positioning guides 240 and the heat-sink positioningguides 242.

The heat-sink positioning guides 242 are surface features configured tointeract with surface features on the first heat sink 210-1 to properlyalign the first heat sink 210-1 within the heat-sink slot 220-1.Although six heat-sink positioning guides 242 are depicted in FIG. 2D,the first region 214-1 may define any number of heat-sink positioningguides 242. In some examples, the heat-sink positioning guides 242include slots that extend from the first heat-sink slot 220-1. Thesecond region 214-2 and the third region 214-3 may include the samefeatures as discussed with reference to the first region 214-1. In someexamples, the first region 214-1 includes one or more adhesive stopfeatures 244. In some examples, the adhesive stop features 244 are slotsthat extend into the first region 214-1 (e.g., having a certain depth).The adhesive stop features 244 may accept adhesive overflow during theassembly process.

The housing 206 is coupled to the module carrier 204, where the modulecarrier 204 is positioned between the housing 206 and the power modules202. In some examples, the housing 206 is coupled to the module carrier204 via one or more fasteners 205. In some examples, the housing 206 iscoupled to the module carrier 204 by welding (e.g., laser welding). Insome examples, the housing 206 includes a plastic material. The housing206 defines a chamber 224, where cooling fluid is injected into thechamber 224 via an opening 225 and expelled from the chamber 224 via anopening 225. Each of the first heat sink 210-1, the second heat sink210-2, and the third heat sink 210-3 includes a portion that is disposedwithin the chamber 224. In some examples, the housing 206 is an inverterhousing. In some examples, the housing 206 is an inverter housing for avehicle.

The power module package 200 includes a ring member 208 that is located(e.g., disposed) between the housing 206 and the module carrier 204. Thering member 208 includes a portion that contacts the housing and aportion that contacts the module carrier 204. In some examples, thehousing 206 may define a groove 271, and the ring member 208 ispositioned in the groove 271 between the housing 206 and the modulecarrier 204. The ring member 208 extends around the first power module202-1, the second power module 202-2, and the third power module 202-3,collectively. In some examples, the ring member 208 includes an O-ring.In some examples, the power module package 200 includes a single ringmember 208.

FIG. 3 illustrates an example of a heat sink 310. The heat sink 310 maybe any of the heat sinks discussed with reference to the previousfigures. The heat sink 310 is a pin fin heat sink. For example, the heatsink 310 includes a base plate 323 and a plurality of pin fins 321 thatextend from the base plate 323. In some examples, as shown in FIG. 3,the pin fins 321 have the same length. FIG. 4 illustrates an example ofa heat sink 410. The heat sink 410 may be any of the heat sinksdiscussed with reference to the previous figures. The heat sink 410 is apin fin heat sink. For example, the heat sink 410 includes a base plate423 and a plurality of pin fins 421 that extend from the base plate 423.In some examples, as shown in FIG. 4, the pin fins 421 have differentlengths.

FIGS. 5A through 5F illustrate a power module package 500 that isassembled according to a first assembly process. The power modulepackage 500 may be an example of any of the power module packagesdiscussed with reference to the previous figures. FIG. 5A illustrates apower module 502 with an attached heat sink 510, which may be an exampleof a first power module 502-1, a second power module 502-2, and a thirdpower module 502-3. Also, the power module 502 includes terminals 530and contacts 532. FIG. 5B illustrates a module carrier 504 defining afirst region 514-1, a second region 514-2, and a third region 514-3. Thefirst region 514-1 defines a first heat-sink slot 520-1. The secondregion 514-2 defines a second heat-sink slot 520-2. The third region514-3 defines a third heat-sink slot 520-3. Also, the module carrier 504may include a plurality of openings 536. FIG. 5C illustrates aperspective of the first region 514-1 that defines module positioningguides 540, heat-sink positioning guides 542, and/or adhesive stopfeatures 544. FIG. 5D illustrates an adhesive material 512 applied tothe first region 514-1, where the adhesive stop features 544 acceptadhesive overflow from the application of the adhesive material 512 tothe first region 514-1. FIG. 5E illustrates the power module 502 coupledto the first region 514-1. FIG. 5F illustrates a first power module502-1, a second power module 502-2, and a third power module 502-3coupled to the module carrier 504 after the adhesive material 512 iscured.

Before the first assembly process starts, the heat sinks 510 are alreadycoupled to the power modules 502. With respect to the first region514-1, an adhesive material 512 is applied to the first region 514-1.Then, the heat sink 510 that is coupled to the first power module 502-1is inserted into the first heat-sink slot 520-1, where the heat-sinkpositioning guides 542 guide the heat sink 510 through the heat-sinkslot 520-1 such that the first power module 502-1 contacts the adhesivematerial 512. The same process happens with respect to the second region514-2 and the third region 514-2. For example, the adhesive material 512is applied to the first region 514-1, the second region 514-2, and thethird region 514-3. Then, the first power module 502-1, the second powermodule 502-2, and the third power module 502-3 are positioned on themodule carrier 504 in the same manner as discussed with reference to thefirst region 514-1. Then, the module carrier 504 with the first powermodule 502-1, the second power module 502-2, and the third power module502-3 may be cured (e.g., oven cured) to cure the adhesive material 512.

FIG. 6 depicts a flowchart 600 depicting example assembly operations forassembling a power module package according to an aspect. Although theflowchart 600 is described with reference to the power module package100, the flowchart may be applicable to any of the power module packagesdiscussed herein. Although the flowchart 600 of FIG. 6 illustratesoperations in sequential order, it will be appreciated that this ismerely an example, and that additional or alternative operations may beincluded. Further, operations of FIG. 6 and related operations may beexecuted in a different order than that shown, or in a parallel oroverlapping fashion.

Operation 602 includes providing a module carrier 104, where the modulecarrier 104 includes a first region 114-1 defining a first heat-sinkslot 120-1 and a second region 114-1 defining a second heat-sink slot120-2. Operation 604 includes applying an adhesive material 112 to thefirst region 114-1 and the second region 114-2. Operation 606 includesinserting a first heat sink 110-1 coupled to a first power module 102-1through the heat-sink slot 120-1 until the first power module 102-1contacts the adhesive material 112. Operation 608 includes inserting asecond heat sink 110-2 coupled to a second power module 102-2 throughthe heat-sink slot 120-2 until the second power module 102-2 contactsthe adhesive material 112.

FIGS. 7A through 7D illustrate a power module package that is assembledaccording to a second assembly process. The power module package ofFIGS. 7A through 7D may be an example of any of the power modulepackages discussed with reference to the previous figures. FIG. 7Aillustrates a module carrier 704 defining a first region 714-1, a secondregion 714-2, and a third region 714-3. The first region 714-1 defines afirst heat-sink slot 720-1. The second region 714-2 defines a secondheat-sink slot 720-2. The third region 714-3 defines a third heat-sinkslot 720-3. In contrast to FIGS. 5A through 5F, the heat sinks (e.g., afirst heat sink 710-1, a second heat sink 710-2, a third heat sink710-3) are not coupled to the power modules at the start of the secondassembly process. Rather, the first heat sink 710-1 is inserted into thefirst heat-sink slot 720-1, the second heat sink 710-2 is inserted intothe second heat-sink slot 720-2, and the third heat sink 710-3 isinserted into the third heat-sink slot 720-3. FIG. 7B illustrates aperspective of the first region 714-1 that defines module positioningguides 740, heat-sink positioning guides 742, and/or adhesive stopfeatures 744. FIG. 7C illustrates an adhesive material 512 applied tothe first region 514-1 and the first heat sink 710-1. In some examples,separate (small) portions 760 are applied to the first heat sink 710-1.In some examples, a single large portion 760 is applied to the firstheat sink 710-1. FIG. 5E illustrates a power module 702 coupled to thefirst region 714-1 and the first heat sink 710-1 via the adhesivematerial 712.

Before the second assembly process starts, the first heat sink 710-1,the second heat sink 710-2, the third heat sink 710-3 are not coupled tothe power modules. Rather, the first heat sink 710-1, the second heatsink 710-2, the third heat sink 710-3 are inserted into the firstheat-sink slot 720-1, the second heat-sink slot 720-2, and the thirdheat-sink slot 720-3, respectively. Then, the adhesive material 712 isapplied to each of the first region 714-1, the second region 714-2, andthe third region 714-3, the first heat sink 710-1, the second heat sink710-2, and the third heat sink 710-3. Then, a first power module isattached to the first region 714-1 and the first heat sink 710-1, asecond power module is attached to the second region 714-2 and thesecond heat sink 710-2, and a third power module is attached to thethird region 714-2 and the third heat sink 710-3. Then, the modulecarrier 704 with the first power module, the second power module, andthe third power module may be cured (e.g., oven cured) to cure theadhesive material 712.

FIG. 8 depicts a flowchart 800 depicting example assembly operations forassembling a power module package according to an aspect. Although theflowchart 800 is described with reference to the power module package100, the flowchart may be applicable to any of the power module packagesdiscussed herein. Although the flowchart 800 of FIG. 8 illustratesoperations in sequential order, it will be appreciated that this ismerely an example, and that additional or alternative operations may beincluded. Further, operations of FIG. 8 and related operations may beexecuted in a different order than that shown, or in a parallel oroverlapping fashion.

Operation 802 includes providing a module carrier 104, where the modulecarrier 104 includes a first region 114-1 defining a first heat-sinkslot 120-1 and a second region 114-2 defining a second heat-sink slot120-2. Operation 804 includes inserting a first heat sink 110-1 into thefirst heat-sink slot 120-1. Operation 806 includes inserting a secondheat sink 110-2 into the second heat-sink slot 120-2. Operation 808includes applying an adhesive material 112 to the first region 114-1,the second region 114-2, the first heat sink 110-1, and the second heatsink 110-2. Operation 810 includes contacting a first power module 102-1to the adhesive material 112 on the first region 114-1 and the firstheat sink 110-1. Operation 812 includes contacting a second power module102-2 to the adhesive material 112 on the second region 114-2 and thesecond heat sink 110-2.

It will be understood that, in the foregoing description, when anelement is referred to as being connected to, electrically connected to,coupled to, or electrically coupled to another element, it may bedirectly connected or coupled to the other element, or one or moreintervening elements may be present. In contrast, when an element isreferred to as being directly connected to or directly coupled toanother element, there are no intervening elements. Although the termsdirectly connected to, or directly coupled to may not be used throughoutthe detailed description, elements that are shown as being directlyconnected or directly coupled can be referred to as such. The claims ofthe application, if any, may be amended to recite exemplaryrelationships described in the specification or shown in the figures.Implementations of the various techniques described herein may beimplemented in (e.g., included in) digital electronic circuitry, or incomputer hardware, firmware, software, or in combinations of them.Portions of methods also may be performed by, and an apparatus may beimplemented as, special purpose logic circuitry, e.g., an FPGA (fieldprogrammable gate array) or an ASIC (application specific integratedcircuit).

Some implementations may be implemented using various semiconductorprocessing and/or packaging techniques. Some implementations may beimplemented using various types of semiconductor processing techniquesassociated with semiconductor substrates including, but not limited to,for example, Silicon (Si), Gallium Arsenide (GaAs), Gallium Nitride(GaN), Silicon Carbide (SiC) and/or so forth.

While certain features of the described implementations have beenillustrated as described herein, many modifications, substitutions,changes and equivalents will now occur to those skilled in the art. Itis, therefore, to be understood that the appended claims are intended tocover all such modifications and changes as fall within the scope of theembodiments. It should be understood that they have been presented byway of example only, not limitation, and various changes in form anddetails may be made. Any portion of the apparatus and/or methodsdescribed herein may be combined in any combination, except mutuallyexclusive combinations. The embodiments described herein can includevarious combinations and/or sub-combinations of the functions,components and/or features of the different embodiments described.

What is claimed is:
 1. A power module package for direct coolingmultiple power modules, the power module package comprising: a pluralityof power modules including a first power module and a second powermodule; a plurality of heat sinks including a first heat sink coupled tothe first power module and a second heat sink coupled to the secondpower module; a module carrier coupled to the plurality of powermodules, the module carrier including a first region defining a firstheat-sink slot and a second region defining a second heat-sink slot, thefirst heat sink extending at least partially through the first heat-sinkslot, the second heat sink extending at least partially through thesecond heat-sink slot; a housing coupled to the module carrier, themodule carrier being disposed between the housing and the plurality ofpower modules; and a ring member located between the module carrier andthe housing.
 2. The power module package of claim 1, wherein the firstheat sink includes metal pin fins.
 3. The power module package of claim1, wherein the first region includes at least one positioning guideconfigured to align at least one of the first power module or the firstheat sink.
 4. The power module package of claim 1, wherein the modulecarrier includes a plastic material.
 5. The power module package ofclaim 1, wherein the plurality of power modules include a third powermodule and the plurality of heat sinks include a third heat sink coupledto the third power module, wherein the module carrier including a thirdregion defining a third heat-sink slot, the third heat sink extending atleast partially through the third heat-sink slot.
 6. The power modulepackage of claim 5, wherein each of the first power module, the secondpower module, and the third power module correspond to a separate phaseof a three phase current of an inverter.
 7. The power module package ofclaim 5, wherein the ring member includes an O-ring that extends aroundthe first power module, the second power module, and the third powermodule, collectively.
 8. The power module package of claim 1, whereinthe first power module includes a half-bridge module.
 9. The powermodule package of claim 1, wherein the module carrier is coupled to thehousing via one or more fasteners.
 10. A power module package for directcooling multiple power modules, the power module package comprising: aplurality of power modules including a first power module, a secondpower module, and a third power module; a plurality of heat sinksincluding a first heat sink coupled to the first power module, a secondheat sink coupled to the second power module, and a third heat sinkcoupled to the third power module; a module carrier coupled to theplurality of power modules, the module carrier including a first regiondefining a first heat-sink slot, a second region defining a secondheat-sink slot, and a third region defining a third heat-sink slot, thefirst heat sink extending at least partially through the first heat-sinkslot, the second heat sink extending at least partially through thesecond heat-sink slot, the third heat sink extending at least partiallythrough the third heat-sink slot; and a housing coupled to the modulecarrier, the housing being coupled to the module carrier being locatedbetween the housing and the plurality of power modules.
 11. The powermodule package of claim 10, further comprising: a ring member locatedbetween the module carrier and a surface of the housing.
 12. The powermodule package of claim 10, wherein the first region defines one or moremodule positioning guides.
 13. The power module package of claim 10,wherein the first region defines one or more heat-sink positioningguides.
 14. The power module package of claim 10, wherein each of thefirst power module, the second power module, and the third power modulecorrespond to a separate phase of a three phase current of an inverter.15. The power module package of claim 10, wherein each of the first heatsink, the second heat sink, and the third heat sink include metal pinfins.
 16. The power module package of claim 10, wherein the modulecarrier includes a metal-based material.